Module component and method of manufacturing the same

ABSTRACT

The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.

TECHNICAL FIELD

The present invention relates to a module component composed by mountinga chip component in a circuit board or by molding a chip component, anda method of manufacturing the same.

BACKGROUND ART

Recently, there is a rapid trend for smaller size, lighter weight,thinner structure, and multiple functions for electronic appliances, andvarious technologies for mounting circuit elements at high density areproposed. One of them is a technology for embedding electroniccomponents in a substrate.

As this type of substrate embedding electronic components, for example,Japanese Laid-open Patent No. 63-169798 is known, and the structure asshown in FIG. 12(a) realizes an equivalent circuit as shown in FIG.12(b).

In the diagram, reference numeral 102 denotes a multi-layer substratelaminating ceramic substrates 121 through 126 in multiple layers.Capacitors 103, 104 and resistor 105 are inserted in penetration holes107 formed in multi-layer substrate 102, and they are electricallyconnected by conductors 106.

In the prior art, however, capacitors 103, 104 and resistor 105 must befinally baked together with multi-layer substrate 102, and specialcomponents excellent in heat resistance are needed. But it is hard toobtain sufficient heat resisting effect as the size of the electroniccomponents becomes smaller. Specified values may not be obtained due tocharacteristic deterioration or characteristic fluctuation by heattreatment at high temperature, and therefore, desired circuitcharacteristics and functions are not obtainable. The dimensions varydue to shrinkage and contraction by heat treatment at high temperature,and it is accordingly hard to obtain components of precise dimensions,and size reduction is limited.

SUMMARY OF THE INVENTION

The invention is devised to solve the conventional problems, and it ishence an object thereof to present a module component capable of:obtaining desired circuit characteristics and functions stably; easilyapplied to automatic insertion and high speed chip components to beburied, and producing very efficiently; and a method of manufacturingthe same, even if the size of the electronic component is reduced.

To achieve the object, the invention is characterized by disposingpenetration holes formed in a circuit board made of a resin materialaccording to a specified rule and accommodating a specific number ofchip components to compose a desired circuit, or arranging a specificnumber of chip components according to a specified rule and molding aresin so as to expose the end electrode of each component to compose adesired circuit. And it is therefore not necessary to heat the buriedchip components at high temperature when forming a module. Consequently,chip components are obtained in specified values, and the circuitcharacteristics, functions, and dimensional precision are stablyobtained exactly as designed. Since the chip components are disposedaccording to a specified rule, it is easy to automate inserting chipcomponents and increase its operation speed even if the size of the chipcomponents is reduced And the circuit composition can be flexibly andeasily changed by just changing inserting positions and type of chipcomponents.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1(a) is a sectional view showing a schematic structure of a modulecomponent in embodiment 1 of the invention, and FIG. 1(b) is a top viewof the component.

FIG. 2 is a sectional view showing other example of resin substrate inthe embodiment.

FIG. 3(a) is a schematic top view of state of chip components insertedand arranged in penetration holes provided in the resin substrate in theembodiment, and FIG. 3(b) is sectional view of the substrate.

FIG. 4 is a top view showing examples of hole shape of penetration holein the embodiment.

FIG. 5 is a sectional view showing examples of shapes of the penetrationhole in the embodiment.

FIG. 6 is a sectional view showing a manufacturing method of the modulecomponent in the embodiment.

FIG. 7 is a sectional view showing a schematic structure of a modulecomponent in embodiment 2 of the invention.

FIG. 8 is a sectional view showing a schematic structure of a modulecomponent in embodiment 3 of the invention.

FIG. 9 is a sectional view showing a molding method of a chip componentin embodiment 4 of the invention.

FIG. 10 is a perspective view showing a structure of molded componentformed by the molding method.

FIG. 11 is a sectional view showing an application example of modulecomponent employing a molded component in embodiment 5 of the invention.

FIG. 12(a) is a sectional view showing a structure of multi-layersubstrate embedding electronic components in a prior art, and FIG. 12(b)is its equivalent circuit diagram.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1

FIG. 1(a) is a sectional view at line I-I′ showing a schematic structureof a module component in embodiment 1 of the invention, and FIG. 1(b) isa top view of the component. In the diagrams, reference numeral 1denotes a resin substrate. In the substrate, chip resistors 2, chipcapacitors 3, and other chip components are inserted into penetrationholes having the nearly same hole shapes as chip components, and theirend electrodes and circuit wirings 4 a and 4 b formed on both sides ofresin substrate 1 are electrically coupled to compose a desired electriccircuit. They are held and reinforced between first auxiliary substrate5 and second auxiliary substrate 6. IC chip 7 and electronic components8 that are hardly reduced in size are mounted on first auxiliarysubstrate 5 and are electrically coupled to wiring circuit 4 c andfurther to circuit wiring 4 a through conductor filling in through-holes9. Reference numeral 7 a denotes a molding resin, 10 denotes an externalelectrode terminal on module component 11.

The sizes of the chip components to be inserted all conforms to 0603(0.6 mm×0.3 mm) of JIS (C-5201-8), and the height of resin substrate 1is 0.6 mm to conform to this standard. Since the sizes of chipcomponents are standardized, even if the circuit composition is changed,resin substrate 1 may be used commonly without changing its height, sothat its versatility is very high. Herein, chip components to beinserted are resistors (R) and capacitors (C), but not limited to them.Coils (L), LC. CR and other composite components can be employed, andthe same effects are obtained as far as the standardized chip componentsare employed.

Further, as shown in FIG. 2, by defining the total height of firstauxiliary substrate 5, resin substrate 1, and second resin substrate 6to 1.0 mm and penetrating therethrough, chip components of size of 1005of JIS can be also employed. Chip components with various heights can bealso employed, a circuit can be flexibly designed, and module componentswith a small size, multiple functions, and higher performance can thusbe realized.

FIG. 3 is a schematic diagram showing the state of chip componentsinserted in the penetration holes provided in the resin substrate, inwhich FIG. 3(a) is a top view and FIG. 3(b) is a sectional view.

In the diagrams, penetration holes (no reference numeral) having almostthe same hole shapes as chip components are formed according to a matrixin resin substrate 21, and chip resistors 22 and chip capacitors 23 areinserted therein. In the diagram, the penetration holes are arranged sothat the chip components may be inserted and arranged while two sides ofeach chip component is aligned. But the penetration holes can be formedso that the centers of the chip components may be aligned, and the sameeffect is thus obtained.

Herein, since the penetration holes are formed regularly and preciselyaccording to a matrix, it is very easy to insert chip components bymachine. And as a result of enhancing a performance of an automaticinserting machine, the chip components may be further reduced in size,and the pitch of penetration holes may be narrowed.

The penetration holes are schematically disposed on the entire surfaceof resin substrate 21, and chip resistors 22 and chip capacitors 23 areinserted alternately, but the technique is not limited to thisconfiguration. A desired circuit can be composed by: forming penetrationholes according to the size of chip components to be inserted only innecessary positions depending on the circuit design and inserting aspecific number of chip components. A desired circuit may be alsocomposed by forming penetration holes in the entire matrix surface andinserting a specific number of chip components only in necessarypositions depending on the circuit design with filling the remainingpenetration holes with insulator or inserting insulators having a chipcomponent size, i.e., dummy components. In the latter case, inparticular, the resin substrate can be used commonly, and the circuitmay be composed flexibly and easily changed only by changing theinserting positions and type of the chip components. And further, byemploying the dummy components, they can be inserted automatically sameas other chip components, and the production efficiency is thus notablyenhanced.

The hole shape of the penetration holes is not limited to the same shapeas the chip components, but may be formed in circular, elliptical orpolygonal shape denoted by reference numerals 24 a through 24 d in FIG.4, as far as the shape is easy to hold positioning within thepenetration hole. And by forming the holes in such shape, it is possibleto insert chip components securely into the penetration hole even if theinsertion angle of the chip component is deviated when inserting bymachine for automation. By filling the gap between penetration hole andchip component with fixing member 24 made of thermosetting resin likeepoxy resin, or by forming support part 26 for supporting the chipcomponent by projecting a part of the penetration hole, the chipcomponent can be securely supported and fixed in the penetration hole.And the reliability of connection of the circuit wiring and chipcomponents disposed on the circuit board may be further enhanced.

The shape of the penetration hole is not limited to a circular column,but may be tapered in such conical shape or Y-form shape as denoted byreference numerals 27 a through 27 c in FIG. 5. And by tapering in suchshape that the end of the chip component may reach to the bottom of thepenetration hole, the opening at the chip-component-inserting-side ofthe penetration hole becomes wider, it is easier to insert chipcomponents by machine, a position of the chip component can beautomatically determined in the penetration hole, and the gap of thepenetration hole and chip component may be smoothly filled up withfixing members. Outstanding merits can thus be obtained.

Further, when an end of the chip component and a surface of the resinsubstrate are formed in different colors, it is easier to inspect avisual appearance, e.g. dropout of chip components, after inserting chipcomponents into penetration holes.

A manufacturing process of the embodiment will be explained by referringto FIG. 6. Resin substrate 31 of glass epoxy or Teflon of which bothsides are lined with copper foil 32 (a: double-side-copper-linedsubstrate) is prepared. Through-holes 33 are formed by drill or laser topenetrate through both copper foils 32 (b: through-hole forming step),and non-electric copper plating is applied to conduct between bothcopper foils 32 (c: through-hole plating step).

With a photolithographic technology, desired circuit wiring patterns 34are formed on both sides of resin substrate 31 (d: pattern etchingstep), penetration holes 35 are formed for inserting chip components inspecified positions according to a matrix (e: parts-inserting-holeforming step), and a specific number of such chip components as chipresistors 36 and chip capacitors 37 are inserted into specifiedpenetration holes 35 (f: parts-inserting step).

Then, for coupling between end electrodes 36 a and 37 a of such chipcomponents as chip resistors 36 and chip capacitors 37, circuit wiringpattern 34, conductive resin, e.g. conductive adhesive material resinelectrode material, are applied or printed on end electrodes 36 a and 37a. And connection electrodes are formed (g: connection-electrode formingstep). And they are held by viscous and adhesive pre-preg layer 41,which is formed with copper foil 40 on one side of auxiliary substrate39 made of thermosetting resin like epoxy resin or phenol resin byheated and compressed in the condition of 180° C., 1 hour, and 30 kg/cm²(h: pre-preg layer forming step).

Herein, resin substrate 31 is lower than chip components, and the totalof resin substrate 31 including both copper foils 32 is higher than thechip components. The configuration is for reinforcing the connection ofcircuit wiring pattern 34 and end electrodes 36 a, 37 a of chipcomponents. But configuration is not limited to above. Resin substrate31 can be almost as high as the chip component, i.e., resin substrate 31can be slightly higher than the chip component, or the total includingboth copper foils 32 can be slightly lower than the chip component.

Then, through-holes 42 are formed and filling with conductive material,and surface circuit wiring pattern 43 is formed by photolithography (i:surface layer pattern etching step). And an IC chip and other electroniccomponents which is hardly reduced in size are mounted on the surface asshown in FIG. 1. so that a module component having a desired circuitcomposition is completed (the process of mounting is not shown).

Herein, first and second auxiliary substrates 4, 5 are made of resinmainly composed of such thermosetting resin as epoxy resin or phenolresin. Thanks to a process at temperature as low as possible, aninfluence of heat treatment on chip components decreases. And withoutemploying special chip components having excellent beat resistance, chipcomponents can work in the specified resistance value and capacity, sothat the circuit characteristics, functions and dimensional precisionexactly as designed may be obtained.

Embodiment 2

FIG. 7 is a sectional view showing a schematic structure of a modulecomponent in embodiment 2 of the invention, in which same elements as inembodiment 1 in FIG. 1 are identified with the same reference numerals,and their explanation is omitted.

In the diagram, reference numeral 50 denotes a bypass capacitor, whichis disposed immediately beneath the terminal of IC chip 7 and coupledthrough a shortest path. It is effective for reducing influence of noisein the wiring circuit which is often a problem in the conventional ICchip. Reference numeral 51 denotes a ground layer made of metal plate orcopper foil, and the layer functions as a ground and cooling plate. Andfurther, bypass line 52 which is made of conductive material like copperor aluminum having excellent heat conductivity immediately beneath theterminal of IC chip 7 releases heat from the IC chip therethroughefficiently. Herein, ground layer 51 is directly formed on resinsubstrate 1, but even when it is formed on second auxiliary substrate 6shown in FIG. 1 to compose so as to be coupled through circuit wiring 4b and through-holes (not shown), the same effects are obtained.Moreover, when bypass line 52 is formed of such a conductive material asa copper chip having a chip component size, it can be insertedautomatically in the same manner as other chip components. And workingefficiency is substantially enhanced as compared with the operation offiling with conductive material.

Embodiment 3

FIG. 8 is a sectional view showing a schematic structure of a modulecomponent in embodiment 3 of the invention, in which same elements as inembodiment 1 in FIG. 1 are identified with same reference numerals, andtheir explanation is omitted.

In the diagram, reference numeral 53 denotes a printed-resistor formedon resin substrate 1. The resister can be formed on circuit wiring 4 awithout inserting a chip component in a penetration hole. After trimmingit, first and second auxiliary substrates 5, 6 can be laminated, whichis very beneficial for reducing size and producing it efficiently.Reference numeral 54 denotes a laminated-capacitor. A capacitor having alow capacitance can be formed with electrode terminals 54 a, 54 b incircuit wirings 4 a, 4 b and dielectric constant of the substrate itself54 c, so that it can be very effective for reducing the size.

As it is clear from the above description, in the foregoing embodiments1 through 3, the penetration holes formed in the circuit board made ofresin are disposed according to a specified rule, and a desired circuitis formed with putting a specific number of chip components therein. Amodule component can be formed without baking the chip components in/onthe resin substrate, and the chip components work in specified values,and the circuit characteristics, functions and dimensional precisionexactly as designed may thus be obtained stably.

Since the penetration holes are disposed according to a specified rule,chip components can easily inserted into penetration holes automaticallyat high speed. And the technique is flexibly applicable even for a chipcomponent having a small size, and moreover the circuit can be composedflexibly and changed easily only by changing an inserting position and atype of the chip component, and outstanding effects are obtained.

Embodiment 4

Another manufacturing method of a module component of the invention willbe explained below. The structure of the module component manufacturedin the manufacturing method of the embodiment is substantially same asthat of embodiment 1, i.e., shown in FIG. 1, and its description isomitted.

The size of chip components to be molded in this embodiment all conformsto, same as in embodiment 1, 0603 (0.6 mm×0.3 mm) of JIS (C-5201-8), andthe height of resin substrate 1 is 0.6 mm to conform to this standard.Thus, since the size of the chip component is standardized same as inembodiment 1, even if the circuit composition is changed, the height ofresin substrate 1 is unchanged, and the versatility is very high.

However, unlike embodiment 1, even if the size is not standardized, thesame effects are obtained in the embodiment as far as the height of thechip component is aligned. In particular when the end electrodes ofstandardized chip components are formed in the lateral direction,instead of the longitudinal direction, the height of resin substrate 1can be suppressed. And a thin type module component may thus be realizedby a relatively simple change only of the formed positions of the endelectrodes.

Referring to FIG. 2, the resin substrate formed by the manufacturingmethod of the embodiment will be explained.

In the diagram, resin substrate 21 is formed where chip resistors 22 andchip capacitors 23 are molded according to a matrix, and the endelectrodes are exposed. The chip components are arranged and molded sothat the two sides of each chip component may be aligned in the diagram,but the same effect is obtained even if chip components are arranged andmolded so that the center of each chip component may be aligned. Thechip components are molded according to a matrix in the diagram, but itis not limited to this, except for disorderly scattering, same effect isobtained if the components are arranged in such a regular manner asconcentric, radial or spiral profile.

Since the chip components are inserted and arranged regularly andprecisely according to a matrix in a molding die, a chip component isinserted automatically at high speed by a machine easily. As theperformance of the automatic-inserting-machine is enhanced, the machineis applicable to downsizing of chip components and to narrowing of apitch of chip components.

Chip components are schematically molded in the entire surface of resinsubstrate 21, and chip resistors 22 and chip capacitors 23 are moldedalternately, but it is not limited to the configuration. Recesses areformed only at specified position in the molding die depending on thecircuit design, and chip components of specific values are inserted andarranged, so that a desired circuit may be composed. Recesses are formedaccording to a matrix in a molding die, and chip components of specificvalues can be inserted, arranged, and molded only in necessary positionsdepending on the circuit design. Or a desired circuit may be formed alsoby inserting dummy components of same height, which components hardlyinfluence to characteristics as module components, in the remainingrecesses which are not filled with chip components.

In particular, when matrix recesses formed in the molding die, the diecan be used commonly, and the circuit can be changed flexibly and easilyonly by changing an inserting position and a type of a chip component.And further, by using the dummy components, chip components can alwaysbe molded in the same state, i.e., in the arranged state of chipcomponents although there is a difference in the kind of components inrecesses of matrix. And it can thus be molded precisely and stably.

Referring to FIG. 9, a molding method of chip components in theembodiment will be explained. In the diagram, reference numeral 61 adenotes a first die, on which recesses 63 are formed for positioning andholding chip components 62 according to a matrix, and first chipcomponents 62 are inserted and arranged in the recesses (a: chipcomponent inserting step). In this case, by forming recesses 63 in firstdie 61 a in such a taper shape as conical or Y-form shape (not shown),the opening area of the chip component-inserting-side becomes wider, amachine can insert the chip components more easily, chip components 62can be positioned automatically in recesses 63, and the gap of recesses63 and chip components 62 can be filled up with resin smoothly. Andoutstanding merit is thus obtained.

After completely inserting the chip components 62, in order to exposeend electrodes 62 a of chip components 62 after forming, second die 61 bis moved into first die 61 a (b: primary molding-die-forming step).Resin 65 a is then put through filling ports 64 a, and a primary moldingis performed (c: primary molding step). After the resin solidified,first die 61 a at inserting-side of chip component 62 is peeled off (d:chip-inserting-side-die peeling step). And third die 61 c is then movedso as to expose another end electrode 62 b of chip component 62 (e:secondary molding-die-forming step). Resin 65 b is put through fillingports 64 b, and secondary molding is performed (f: secondary moldingstep). Molded component 66 shown in FIG. 10 is obtained after peelingoff second and third dies 61 b, 61 c and shaping the component (g:die-peeling, shaping step).

For molding, by employing resin mainly composed of thermosetting resinmaterial such as epoxy resin or phenol resin, and by processing at lowtemperature as possible, an influence of a heat treatment on chipcomponents decreases. And without employing special chip componentshaving an excellent heat resistance, the chip components work in thespecified resistance value and capacity, so that the circuitcharacteristics, functions, and dimensional precision may be obtainedexactly as designed.

By containing a filler having an excellent heat conductivity and heatresistance in the resin, the module component having an excellent heatrelease and heat resistance is realized. And more specifically, theheat-release can be improved by containing at least one of Al₂O₃, SiC,Al₃N₄, and Si₃N₄ as the filler in the resin. And the heat resistance isenhanced by containing ceramic powder and/or SiO₂ as the filler in theresin. Moreover, by containing magnetic material such as ferrite in theresin, a module component resistant to an influence of noise may berealized.

Embodiment 5

FIG. 11 is a sectional view showing a schematic structure of a modulecomponent in embodiment 5 of the invention, representing an applicationexample of module component using module component 66 shown in FIG. 10.FIG. 11(a) illustrates an example of mounting molded component 66 onmulti-layer substrate 70. FIG. 11(b) illustrates an example of buryingmolded component 66 in multi-layer substrate 70 FIG. 11(c) illustratesan example of forming molded component 66 smaller than IC chip 7 andburying it in multi-layer substrate 70. Reference numerals 71, 72 denotewiring patterns and through-holes provided in multi-layer substrate 70,respectively. The same elements as in embodiment 4 are identified withthe same reference numerals, and their explanation is omitted.

In any configuration in the diagram, since the terminals of IC chip 7are directly coupled with wiring patterns 71 of multi-layer substrate 70through chip components 62 in module component 66, component 66 ishardly influenced by a noise, which is induced from the conventionalwiring from the IC chip.

Recently, a CPU is rapidly progressed at high speed, i.e., highfrequency, and the driving frequency will jump into the GHz band in nearfuture. As capacitors are usually used in the power source line of theCPU, and the speed is ultimately advanced, an influence of an equivalentseries resistance (ESR) and an equivalent series inductance (ESL)occurring between the capacitor and the CPU cannot be ignored. And howto suppress it has been a key for a high-speed-operation of the CPU. Bydisposing chip capacitors around the IC chip (not shown), these valuesare suppressed. As the speed becomes higher, these values becomenoticeable even in such disposing.

Accordingly, as described in the embodiment, when chip capacitors ofchip capacitors 62 function as bypass capacitors, the ESR and ESL can besuppressed very small since the CPU and capacitors can be coupleddirectly, and it is thus applicable to higher speed in future. Moreover,when all or some of chip components 62 are designed to function asbypass capacitors, and when common electrodes are provided on both sidesto cover and couple directly the end electrodes exposed therefrom withthe CPU, it is applicable to a much higher speed operation.

In the diagram, when conductors having an excellent beat conductivity(e.g. copper, aluminum) are used in some of chip components 62, they canfunction as a bypass line, and IC chip 7 can thus be cooled moreefficiently.

As clear from the description herein, according to embodiments 4 and 5,since the substrate is formed by molding the resin, it is not necessaryto heat chip components at high temperature, and the chip componentswork in specified values. And the circuit characteristics, functions,and dimensional precision may thus be obtained exactly and stably asdesigned. Since the chip components are disposed and molded with resinaccording to a specified rule, chip components to be inserted in themolding die automatically at a high speed are realized easily. Thetechnique is flexibly applicable even if the size of the chip componentsis reduced, the circuit composition may be flexibly and easily changedonly by changing an inserting position and a type of the chipcomponents, and outstanding effect is obtained.

With the manufacturing method of embodiment 4, module componentsdescribed in embodiments 2 and 3 can be formed, and the modulecomponents formed with the method of embodiment 1 can be used inapplication examples in embodiment 5, which is evident and is notparticularly explained herein.

INDUSTRIAL APPLICABILITY

According to the invention, it is not required to heat the buried chipcomponents at high temperature when forming module components, and thechip components work in specified values. And therefore, the circuitcharacteristics, functions, and dimensional precision may be obtainedexactly and stably as designed. Since the chip components are disposedaccording to a specified rule, automatic and high speed insertion ofchip components is easily realized. The technique is flexibly applicableeven if the size of the chip components is reduced, and moreover, thecircuit composition may be flexibly and easily changed only by changingthe inserting position and type of the chip components.

What is claimed is:
 1. A module component comprising: a substrate madeof resin having a plurality of penetration holes, said plurality ofpenetration holes disposed in said substrate so as to form a matrix of Naligned rows and M aligned columns of said penetration holes; each ofsaid penetration holes being aligned in both a row and a column of saidmatrix, and each row and each column of said matrix comprising at leastthree penetration holes; circuit wirings disposed on both sides of saidsubstrate, respectively; and a chip component having a height almost thesame as a depth of each of said penetration holes, said chip componentdisposed in one of said penetration holes for electrically coupling saidcircuit wirings disposed on both sides of said substrate, wherein N isequal to or greater than 3, and M is equal to or greater than
 3. 2. Amodule component according to claim 1, further comprising a fixingmember for filling up a gap between said chip component and said one ofsaid penetration holes.
 3. A module component according to claim 1,wherein at least one of the penetration holes is tapered.
 4. A modulecomponent according to claim 1, wherein support means is formed at saidone of said penetration holes for supporting said chip component.
 5. Amodule component according to claim 1, further comprising an auxiliarysubstrate disposed over at least one side of the substrate.
 6. A modulecomponent according to claim 1, wherein an end of said chip componentand a surface of said substrate are formed in different colors.
 7. Amodule component according to claim 1, further comprising a ground layerdisposed beneath said substrate, said ground layer being coupled withone of said circuit wirings disposed on a lower side of said substrate.8. A module component according to claim 1, further comprising a dummycomponent disposed in another penetration hole of said penetrationholes, said dummy component having a size almost the same as said chipcomponents and functioning as an insulator.
 9. A module componentcomprising: a substrate made of resin having penetration holes; circuitwirings disposed on both sides of said substrate, respectively; a firstauxiliary substrate and a second auxiliary substrate disposed such thatsaid substrate is disposed between said first auxiliary substrate andsaid second auxiliary substrate, and a chip component disposed in one ofsaid penetration holes, said chip component having a predeterminedheight being greater than the depth of one of said penetration holes andnot projecting from said first and said second auxiliary substrate, saidchip component electrically coupling said circuit wirings to each other,wherein said penetration holes are formed at positions according to amatrix.
 10. A module component comprising: a substrate made of resinhaving penetration holes; circuit wirings disposed on both sides of saidsubstrate, respectively; a chip component, having a height almost sameas a depth of one of said penetration holes, and placed in one of saidpenetration holes for electrically coupling said circuit wirings to eachother; an auxiliary substrate disposed over said substrate; an IC chipmounted on said auxiliary substrate; and a capacitor placed in anotherone of said penetration holes immediately beneath said IC chip to becoupled directly with said IC chip, wherein said penetration holes areformed at positions according to a matrix.
 11. A module componentcomprising: a substrate made of resin having penetration holes; circuitwirings disposed on both sides of said substrate, respectively; a chipcomponent, having a height almost same as a depth of one of saidpenetration holes, and placed in one of said penetration holes forelectrically coupling said circuit wirings to each other; an auxiliarysubstrate disposed over said substrate; an IC chip mounted on saidauxiliary substrate; and a ground layer disposed beneath said substrate,wherein the penetration holes are formed at positions according to amatrix; and wherein said IC chip is coupled directly with said groundlayer.
 12. A module component comprising: a substrate made of resinhaving penetration holes; circuit wirings disposed on both sides of saidsubstrate, respectively; a chip component having a height almost same asa depth of one of said penetration holes and placed in one of saidpenetration holes for electrically coupling said circuit wirings to eachother, wherein said penetration holes are formed at positions accordingto a matrix, and wherein said penetration holes are tapered.
 13. Amodule component comprising: a substrate made of resin havingpenetration holes; circuit wirings disposed on both sides of saidsubstrate, respectively; a chip component having a height almost same asa depth of one of said penetration holes, and placed in one of saidpenetration holes for electrically coupling said circuit wirings to eachother; and a ground layer disposed beneath said substrate, said groundlayer being coupled with one of said circuit wirings disposed on a lowerside of said substrate, wherein the penetration holes are formed atpositions according to a matrix.
 14. A module component comprising: asubstrate made of resin having a penetration hole; circuit wiringsdisposed on both sides of said substrate, respectively; a chip componenthaving a height almost same as a depth of said penetration hole, andplaced in said penetration hole for electrically coupling said circuitwirings to each other; an auxiliary substrate disposed over saidsubstrate; and a ground layer disposed beneath said auxiliary substrate,said ground layer being coupled with one of said circuit wiringsdisposed on a lower side of said substrate.
 15. A module componentcomprising: a substrate made of resin having penetration holes; circuitwirings disposed on both sides of said substrate, respectively; a chipcomponent having a height almost same as a depth of one of saidpenetration holes, and placed in one of said penetration holes forelectrically coupling said circuit wirings to each other; an auxiliarysubstrate disposed over said substrate; an IC chip mounted on saidauxiliary substrate; and a ground layer disposed beneath said auxiliarysubstrate, wherein the penetration holes are formed at a positionaccording to a matrix, and wherein said IC chip is coupled directly withsaid ground layer.